- 企業(yè)類(lèi)型：貿(mào)易商
- 新舊程度：全新
- 原產(chǎn)地：馬來(lái)西亞
熱門(mén)應(yīng)用：缺件、偏移、立碑、側(cè)立、多錫、少錫、高度、虛焊、假焊、浮高、翹腳、爬錫,可測(cè)PCB綠油出的異物，飛料,OCV技術(shù)檢測(cè)錯(cuò)件和反向.
AOI自誕生起為了解決2維檢測(cè)的瓶頸盡出現(xiàn)了3D AOI,很好解決了2D AOI無(wú)法解決的問(wèn)題， 但是為了利用3D AOI技術(shù)檢測(cè)元器件，存在很多需要解決的課題。Vitrox 科技的3D AOI完全解決了該瓶頸創(chuàng)造出了業(yè)界新的價(jià)值。
2D AOI 局限-2D AOI技術(shù)基于2D圖片來(lái)分析, 但是不足于判斷所有不良類(lèi)型。2D 檢測(cè)方式大部分2D AOI發(fā)生誤報(bào)及漏報(bào) … 工程師技術(shù)能力及經(jīng)驗(yàn)來(lái)調(diào)試并利用圖片信息解決
2D 無(wú)法解決板彎(PCB Warp)問(wèn)題, 板彎導(dǎo)致誤報(bào)及檢測(cè)受影響.
3DAOI產(chǎn)線
與現(xiàn)有的2D AOI不同，Vitrox 3D AOI 測(cè)量爬錫及元件高度及體積，判定良， 不良，所有Vitrox 3D AOI的檢測(cè)條件設(shè)定方法即直官有簡(jiǎn)便。 另外V3D AOI基于Vitrox準(zhǔn)確信賴(lài)性的檢測(cè)結(jié)果數(shù)據(jù)，實(shí)行工程反饋信息，幫助客戶工業(yè)優(yōu)化。
1)不受顏色影響的檢測(cè)能力
2)所有數(shù)據(jù)的定量化 基于測(cè)量的3D AOI超越了2D檢測(cè)方式，提供準(zhǔn)確的不良判斷及檢測(cè)數(shù)據(jù).
3 )編程(檢測(cè)條件)也定量化
4) 創(chuàng)新板彎實(shí)時(shí)補(bǔ)償功能
5) OCV, OCR, Polarity Mark 檢測(cè)功能
6) 真正3D彩色圖片
ViTrox V510 3D AOI——先進(jìn)光學(xué)檢測(cè)設(shè)備。在短短的一年半里，它經(jīng)已獲得廣泛認(rèn)可。無(wú)論是在檢查覆蓋率、靈活性、可支持性以及編程方法等方面，V510 3D AOI皆可發(fā)揮其卓越的協(xié)同作用。V510 3D AOI檢測(cè)范圍廣泛，覆蓋焊點(diǎn)缺陷、低對(duì)比元件位置、錯(cuò)件檢查等。
熱門(mén)應(yīng)用：缺件、偏移、立碑、側(cè)立、多錫、少錫、高度、IC引腳虛焊、零件起翹、BGA翹起,可測(cè)PCB綠油出的異物，飛料,OCV技術(shù)檢測(cè)錯(cuò)件和反向.
主要參數(shù)：
| Board Dimensions | V510i Optimus 3D1 | V510i 3D XXL |
| Maximum board size | 510 mm by 510 mm (20 inch by 20 inch) | 690 mm by 620 mm (27.1inch by 24.4 inch) Upgradable to 690 mm by 960 mm (27.1 inch by 37.8 inch) |
| Minimum board size | 50 mm by 50 mm (2 inch by 2 inch) | 50 mm by 50 mm (2 inch by 2 inch) |
| Maximum board thickness | 4 mm (0.16 inch) | 15 mm (0.59 inch) |
| Minimum board thickness | 0.5 mm (0.02 inch) | 0.5 mm (0.02 inch) |
| Board weight | Up to 3 kg (6.6 lb) | Up to 7 kg (15.4 lb) Upgradable to 15 kg |
| Maximum inspected area | 503 mm by 510 mm (19.8 inch by 20 inch) | 620 mm by 683 mm (24.4 inch by 26.8 inch) |
| Clearance | ||
| Top side of board | 50 mm (1.97 inch) | 50 mm (1.97 inch) |
| Bottom side of board | 70 mm (2.75 inch) | 70 mm (2.75 inch) |
| Minimum edge clearance | 3.5 mm (0.14 inch) | 3.5 mm (0.14 inch) |
| Maximum PCB Warpage | +- 5mm | +- 5mm |
| Conveyor height range | 856 mm to 965 mm (33.7 inch to 37.9 inch) | 856 mm to 965 mm (33.7 inch to 37.9 inch) |
| System Dimensions | ||
| Footprint | W: 1060 mm (3.5 ft) x D: 1352 mm (4.4 ft) x H: 2028 mm (6.7 ft) | W: 1460 mm (4.8 ft) x D: 1500 mm (4.9 ft) x H: 2130 mm (6.98 ft) |
| Weight | ~ 750 kgs | ~ 1500 kgs |
| Functionality | ||
| 2D Inspection Coverage | Missing, offset, skewed, polarity, billboard, tombstone, lifted/bent leads, excess/insufficient solder, bridging, wrong part | |
| 3D Inspection Coverage | Package Coplanarity, Lifted Lead, Presence/absence, foreign material, dimple | |
| Height Accuracy | ±2μm (on ViTrox adjustment jig) | |
| Board level and component level traceability | External barcode reader configured; Camera-read barcodes; OCR capability with batch code logging | |
| Hardware Systems | ||
| Camera System | 4 mega pixel digital camera; 111-20 μm per pixel resolution | |
| Field of view: 40 mm x 40 mm | ||
| Lens | Telecentric Lens for 20μm per pixel | |
| Telecentric Lens for 11μm per pixel (Optional) | ||
| Lighting System | New Lighting Head, 4X Projectors | |
主要客戶:
